METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE

• Main Authors: SHIMURA SHOJIRO, OMURA KAZUYOSHI
• Format: Patent
• Language: English; Japanese
• Published: 11.10.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a method for manufacturing a light-emitting device capable of improving a yield.SOLUTION: A method for manufacturing a light-emitting device according to one embodiment of the present disclosure includes an aggregate substrate preparing step, a first irradiating step, and a second irradiating step. The aggregate substrate preparing step prepares an aggregate substrate including at least one substrate part in which a light-emitting element is arranged and a frame part continuous with the substrate part. The first irradiating step separates the substrate part from the aggregate substrate by scanning and irradiating an outer peripheral line of the substrate part in the aggregate substrate with laser light. The second irradiating step subjects an outer peripheral side surface of the substrate part to surface treatment by scanning and irradiating the outer peripheral line with the laser light between the separated substrate part and the frame part after the first irradiating step.SELECTED DRAWING: Figure 3 【課題】 歩留まりが向上できる発光装置の製造方法を提供する。【解決手段】 本開示の一実施形態に係る発光装置の製造方法は、発光素子が配置された少なくとも１つの基板部と、基板部と連続する枠部とを含む集合基板を準備する集合基板準備工程と、集合基板における基板部の外周ラインに沿ってレーザ光を走査して照射し、基板部を集合基板から分離する第１照射工程と、第１照射工程の後、分離された基板部と枠部との間において、外周ラインに沿ってレーザ光を走査して照射し、基板部の外周側面に表面加工を施す第２照射工程と、を含む。【選択図】図３