EXPANDABLE POLYSTYRENIC RESIN PARTICLE, PRE-EXPANDED PARTICLE OF THE SAME, AND EXPANDED MOLDING

• Main Authors: KIGUCHI TARO, SUZUKI KIRITO, KOBAYASHI TAKESHI, OCHIKOSHI SHINOBU
• Format: Patent
• Language: English; Japanese
• Published: 11.10.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BLASTING; CHEMISTRY; COMPOSITIONS BASED THEREON; FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEATGENERATING MEANS, IN GENERAL; GENERAL PROCESSES OF COMPOUNDING; HEATING; LIGHTING; MECHANICAL ENGINEERING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; RANGES; THEIR PREPARATION OR CHEMICAL WORKING-UP; VENTILATING; WEAPONS; WORKING-UP

To provide expandable polystyrenic resin particles which enable provision of a novel expanded molding that is excellent in dimensional stability at 95°C, has high heat insulation properties and flame retardant performance, and has a small content of VOC.SOLUTION: Expandable polystyrenic resin particles contain a resin composition containing a base material resin, a bromine-based flame retardant, and graphite, wherein the base material resin contains a styrenic copolymer resin containing a styrenic monomer unit as a constitutional unit, the resin composition has a glass transition point of 105°C or higher and 125°C or lower, and a content of the styrene monomer is less than 0.03 wt.%.SELECTED DRAWING: None 【課題】９５℃での寸法安定性に優れ、高い断熱性と難燃性能を有し、ＶＯＣの含有量が少ない新規の発泡成形体を提供し得る発泡性ポリスチレン系樹脂粒子を提供する。【解決手段】基材樹脂と、臭素系難燃剤と、グラファイトとを含有する樹脂組成物を含む発泡性ポリスチレン系樹脂粒子であり、前記基材樹脂は、構成単位としてスチレン系単量体単位を含有するスチレン系共重合樹脂を含み、前記樹脂組成物は、ガラス転移点が１０５℃以上１２５℃以下であり、スチレン単量体の含有量が、０．０３重量％未満である、発泡性ポリスチレン系樹脂粒子。【選択図】なし