SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

• Main Author: OBARA TAKANORI
• Format: Patent
• Language: English; Japanese
• Published: 06.10.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a technique that enables a reduction in an operation of a substrate processing apparatus and shortening of a time taken by substrate processing.SOLUTION: A substrate processing apparatus comprises: a holding part for holding a substrate; a liquid supply part for supplying, to a main surface of the substrate held by the holding part, a first processing liquid and a second processing liquid, which is different from the first processing liquid, in order; a friction body that, during the supply of the first processing liquid and the second processing liquid, contacts the main surface of the substrate and rubs the main surface; a moving part for moving a contact position of the friction body, at which it contacts the main surface of the substrate, in a first axial direction and a second axial direction that are parallel to the main surface of the substrate and cross each other; and a control part for controlling the liquid supply part and the moving part so that the contact position of the friction body is moved toward one side in the first axial direction during the supply of the first processing liquid and is moved toward the other side in the first axial direction during the subsequent supply of the second processing liquid.SELECTED DRAWING: Figure 1 【課題】基板処理装置の動作を軽減でき、基板処理にかかる時間を短縮できる、技術を提供する。【解決手段】基板を保持する保持部と、前記保持部で保持した状態の前記基板の主面に対して、第１処理液及び前記第１処理液とは異なる第２処理液を順番に供給する液供給部と、前記第１処理液及び前記第２処理液の供給中に、前記基板の前記主面と接触し、前記主面を擦る摩擦体と、前記基板の前記主面における前記摩擦体の接触位置を、前記基板の前記主面に平行な方向であって互いに交わる第１軸方向及び第２軸方向に移動する移動部と、前記液供給部と前記移動部とを制御し、前記第１処理液の供給中に、前記摩擦体の前記接触位置を前記第１軸方向の一方向に移動し、続く前記第２処理液の供給中に、前記摩擦体の前記接触位置を前記第１軸方向の他方向に移動する制御部とを備える、基板処理装置。【選択図】図１