MULTILAYER ELECTRONIC COMPONENT

To provide: a multilayer electronic component preventing external moisture penetration and the like to have improved reliability; a multilayer electronic component alleviating external impacts to have high impact resistance; and a multilayer electronic component in which a mounting space can be mini...

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Bibliographic Details
Main Authors KIM YOUNG KEY, SONG SOO-HOWANG, AHN YOUNG GHYU
Format Patent
LanguageEnglish
Japanese
Published 06.10.2023
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Summary:To provide: a multilayer electronic component preventing external moisture penetration and the like to have improved reliability; a multilayer electronic component alleviating external impacts to have high impact resistance; and a multilayer electronic component in which a mounting space can be minimized.SOLUTION: A multilayer electronic component includes: a body including a dielectric layer and an internal electrode; an external electrode disposed outside the body; and an insulating layer disposed on the external electrode. The external electrode is disposed to cover an exposed surface of an outermost layer of the internal electrode, and is formed to have a thickness, equal to or less than a thickness of the body, and the insulating layer is disposed to cover an end of the external electrode, to improve moisture resistance reliability.SELECTED DRAWING: Figure 4 【課題】外部の水分浸透などを防止して信頼性が向上した積層型電子部品、外部の衝撃を緩和して衝撃に強い積層型電子部品、及び実装空間を最小化することができる積層型電子部品を提供する。【解決手段】本発明の一実施形態による積層型電子部品は、誘電体層及び内部電極を含む本体、上記本体の外側に配置される外部電極、上記外部電極上に配置される絶縁層を含み、上記外部電極は内部電極の最外層の露出面を覆うように配置され、本体厚さ以下に形成され、上記絶縁層は上記外部電極の端部を覆うように配置されることで、耐湿信頼性が向上することができる。【選択図】図4
Bibliography:Application Number: JP20220100779