Sn-PLATED BRASS PLATE MATERIAL AND PRODUCTION METHOD THEREOF

• Main Author: SHIMAZU MASAHIRO
• Format: Patent
• Language: English; Japanese
• Published: 06.10.2023
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

To provide a Sn-plated brass plate material in which a surface layer of a structure in which a Cu layer directly contacting a brass exists is easily assembled with low cost when provided to heat treatment at a temperature where melting of Sn does not occur.SOLUTION: A Sn-plated brass plate material includes a Cu-plated layer with a thickness of 0.28-0.80 μm on a surface of a substrate made of a brass plate, and moreover, a Sn-plated layer with a thickness of 2.8-5.0 μm on the Cu-plated layer. The Sn-plated brass plate material has a property in which a Cu layer derived from the Cu-plated layer in the whole area on the substrate on which the Cu-plated layer and the Sn-plated layer are formed after heat treatment when the heat treatment is performed while being kept at 150°C for 90 minutes in atmosphere.SELECTED DRAWING: Figure 1 【課題】Ｓｎの溶融が生じない温度での熱処理に供したときに、黄銅と直接接しているＣｕ層が存在する構造の表層部が低コストで容易に構築されるＳｎめっき黄銅板材を提供する。【解決手段】上記課題は、黄銅板からなる基材の表面上に、厚さ０.２８～０.８０μｍのＣｕめっき層を有し、前記Ｃｕめっき層の上に厚さ２.８～５.０μｍのＳｎめっき層を有するＳｎめっき黄銅板材によって達成される。このＳｎめっき黄銅板材は、大気雰囲気中、１５０℃で９０分保持する熱処理を施したとき、その熱処理後に、Ｃｕめっき層とＳｎめっき層が形成されていた前記基材上の領域の全面にＣｕめっき層に由来するＣｕ層が残存する性質を有する。【選択図】図１