SUBSTRATE TREATMENT DEVICE
To provide a substrate treatment device that is configured so that workability in maintaining respective parts of the substrate treatment device can be improved while suppressing footprints from enlarging.SOLUTION: A substrate treatment device 1 comprises a substrate carry-in/carry-out part, a conve...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
05.10.2023
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a substrate treatment device that is configured so that workability in maintaining respective parts of the substrate treatment device can be improved while suppressing footprints from enlarging.SOLUTION: A substrate treatment device 1 comprises a substrate carry-in/carry-out part, a conveying part 310 and a treating part 330 provided to extend in parallel in a first direction from the substrate carry-in/carry-out part. The conveying part 310 conveys a carrier 9 that stores untreated substrates in the first direction from the substrate carry-in/carry-out part. The treating part 330 includes a plurality of treatment tanks 331a. In the treating part 330, the carrier 9 storing a plurality of substrates is conveyed in a second direction that is opposite to the first direction. The conveyed carried 9 is immersed in at least one of a plurality of treatment liquids stored in the plurality of treatment tanks 331a. A maintenance space MS1 is formed adjacently to the treating part 330 in a planer view. The conveying part 310 overlaps with at least a part of the treating part 330 and the maintenance space MS1 in a planar view.SELECTED DRAWING: Figure 1
【課題】フットプリントの拡大を抑制しつつ基板処理装置の各部のメンテナンスの作業性を向上させることが可能な基板処理装置を提供する。【解決手段】基板処理装置1は、基板搬入搬出部と、基板搬入搬出部から第1の方向に並列に延びるように設けられる搬送部310および処理部330とを備える。搬送部310は、未処理の基板を収容するキャリア9を基板搬入搬出部から第1の方向に搬送する。処理部330は、複数の処理槽331aを含む。処理部330においては、複数の基板が収容されたキャリア9が第1の方向とは逆の第2の方向に搬送される。搬送されるキャリア9が複数の処理槽331aに貯留された複数の処理液のうち少なくとも1つに浸漬される。平面視で処理部330に隣り合うように、メンテナンス空間MS1が形成されている。搬送部310は、平面視で処理部330およびメンテナンス空間MS1のうち少なくとも一部に重なる。【選択図】図1 |
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Bibliography: | Application Number: JP20220048784 |