COPPER CERAMIC BONDED BODY, BRAZING FILLER METAL, AND METHOD FOR PRODUCING COPPER CERAMIC BONDED BODY

• Main Authors: OKISHIRO KENJI, OKAMOTO ATSUSHI, NOKAWA GENYA, TAKANO SHUN
• Format: Patent
• Language: English; Japanese
• Published: 05.10.2023
• Subjects: ADDITIVE MANUFACTURING TECHNOLOGY; ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING; ALLOYS; ARTIFICIAL STONE; CASTING; CEMENTS; CERAMICS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS; CONCRETE; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; FERROUS OR NON-FERROUS ALLOYS; LIME, MAGNESIA; MACHINE TOOLS; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; POWDER METALLURGY; REFRACTORIES; SLAG; SOLDERING OR UNSOLDERING; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; TREATMENT OF NATURAL STONE; WELDING; WORKING BY LASER BEAM; WORKING METALLIC POWDER

To provide a copper ceramic bonded body that has high bonding strength.SOLUTION: Provided is a copper ceramic bonded body that has a copper material 10 made of Cu or a Cu alloy, a ceramic material 20 bonded to the copper material and made of a nitride of Si or Al, and a bonding layer 30 formed on the bonding surface between the copper material and the ceramic material, containing Cu and Mg, and further containing at least one active metal element selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Ca, Y, Ce, La, Sm, Yb, Nd, Gd and Er, and in which the shear strength of the bonding layer is 10 MPa or more.SELECTED DRAWING: Figure 1 【課題】高い接合強度を有する銅セラミックス接合体を提供する。【解決手段】ＣｕまたはＣｕ合金からなる銅材１０と、銅材に接合され、ＳｉまたはＡｌの窒化物からなるセラミックス材２０と、銅材とセラミックス材との接合面に形成され、Ｃｕと、Ｍｇと、を含み、Ｔｉ，Ｚｒ，Ｈｆ，Ｖ，Ｎｂ，Ｔａ，Ｃｒ，Ｍｏ，Ｗ，Ｃａ，Ｙ，Ｃｅ，Ｌａ，Ｓｍ，Ｙｂ，Ｎｄ，Ｇｄ，Ｅｒからなる群より選択される少なくとも一種の活性金属元素をさらに含む接合層３０と、を有し、接合層のせん断強度が１０ＭＰａ以上である。【選択図】図１