COOLING DEVICE

• Main Authors: MATSUDA HIROTERU, KAWAMIZU TSUTOMU
• Format: Patent
• Language: English; Japanese
• Published: 04.10.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide a cooling device that exhibits even higher cooling effects.SOLUTION: A cooling device that cools a plurality of semiconductor components mounted on the surface of a substrate and arranged in a first direction includes a base attached to the back of the substrate, a bottom plate that is spaced apart from the base and forms a flow path through which a refrigerant flows between the base plate and the base, and a cooling body placed in the flow path, and the flow path is provided independently for each semiconductor component, and has a plurality of flow path sections extending in a second direction perpendicular to the first direction, and an inlet for supplying a refrigerant to each of the flow path sections is formed in the center of the bottom plate in the second direction.SELECTED DRAWING: Figure 2 【課題】さらに高い冷却効果を発揮する冷却装置を提供する。【解決手段】冷却装置は、基板の表面に実装され、第一方向に配列された複数の半導体部品を冷却する冷却装置であって、基板の裏面に取り付けられたベースと、ベースに離間して配置されることでベースとの間に冷媒が流通する流路を形成する底板と、流路内に配置された冷却体と、を備え、流路は、半導体部品ごとに独立して設けられ、第一方向に直交する第二方向に延びる複数の流路区画を有し、底板における第二方向の中央部には、各流路区画に冷媒を供給する導入口が形成されている。【選択図】図２