CUTTING SYSTEM, CONTROL METHOD, PROGRAM AND CONTROL SYSTEM

• Main Authors: KUSUNOKI TOMOKAZU, SAITO KEIGO, NAKATANI TOMOHIRO, KOBAYASHI KOSUKE, SHINKAI KOICHI, NISHIMURA YOSHINORI
• Format: Patent
• Language: English; Japanese
• Published: 04.10.2023
• Subjects: COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINE TOOLS; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; METAL-WORKING NOT OTHERWISE PROVIDED FOR; NAILING OR STAPLING MACHINES IN GENERAL; PERFORMING OPERATIONS; PLANING, DRILLING, MILLING, TURNING OR UNIVERSAL MACHINES FORWOOD OR SIMILAR MATERIAL; POLISHING; TRANSPORTING; WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL

To enhance the work efficiency of the cutting work.SOLUTION: A cutting system 1 includes a cutting unit 10, an imaging unit 20 and a control device 60. The cutting unit 10 includes a cutting tool 11 that performs cutting to an object 3. The cutting unit 10 performs cutting to the object 3 by using the cutting tool 11 with control by the control device 60. The imaging unit 20 images the object 3. The control device 60 includes a region extraction unit 67 and a processing control unit 71. The region extraction unit 67 extracts a processing possible region R1 where the cutting work can be performed on a surface of the object 3 by inputting a pre-processing image obtained by imaging the object 3 by the imaging unit 20 to a first learned model LM1. The processing control unit 71 controls the cutting unit 10 so as to perform cutting to the processing possible region R1.SELECTED DRAWING: Figure 1 【課題】切削加工の作業効率を高めること。【解決手段】切削加工システム１は、切削ユニット１０と、撮像ユニット２０と、制御装置６０と、を備える。切削ユニット１０は、対象物３に対して切削を行う切削工具１１を有する。切削ユニット１０は、制御装置６０による制御により、切削工具１１を用いて対象物３に対して切削を行う。撮像ユニット２０は、対象物３を撮像する。制御装置６０は、領域抽出部６７と、加工制御部７１と、を有する。領域抽出部６７は、撮像ユニット２０が対象物３を撮像して得た加工前画像を第１学習済みモデルＬＭ１に入力することによって、対象物３の表面において切削加工が可能な加工可能領域Ｒ１を抽出する。加工制御部７１は、加工可能領域Ｒ１に対して切削を行うよう切削ユニット１０を制御する。【選択図】図１