UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION

SOLUTION: This disclosure relates generally to a patterning structure including an underlayer and an imaging layer, as well as methods and apparatuses thereof. In particular embodiments, the underlayer enhances radiation absorptivity and/or patterning performance of the imaging layer.SELECTED DRAWIN...

Full description

Saved in:
Bibliographic Details
Main Authors MARY ANNE MANUMPIL, XUE JUN, LI DA, YU JENGYI, SAMANTHA S H TAN
Format Patent
LanguageEnglish
Japanese
Published 02.10.2023
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:SOLUTION: This disclosure relates generally to a patterning structure including an underlayer and an imaging layer, as well as methods and apparatuses thereof. In particular embodiments, the underlayer enhances radiation absorptivity and/or patterning performance of the imaging layer.SELECTED DRAWING: Figure 2D 【解決手段】本開示は、一般に、下層およびイメージング層を備えたパターニング構造、ならびに、その方法および装置に関する。特定の実施形態において、下層は、イメージング層の放射線吸収率および／またはパターニング性能を高める。【選択図】図２Ｄ
Bibliography:Application Number: JP20230126668