WIRING STRUCTURE, SEMICONDUCTOR MODULE, AND VEHICLE

• Main Authors: NAKADA HITOSHI, HYUGA YUICHIRO, KANAI NAOYUKI
• Format: Patent
• Language: English; Japanese
• Published: 29.09.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a wiring structure that can improve productivity.SOLUTION: A conductive member (5) constituting a wiring structure includes a first joint portion (20) joined to an electronic component (4), a second joint portion (21) joined to a connection target (14) for the electronic component, an upr...