WIRING STRUCTURE, SEMICONDUCTOR MODULE, AND VEHICLE

To provide a wiring structure that can improve productivity.SOLUTION: A conductive member (5) constituting a wiring structure includes a first joint portion (20) joined to an electronic component (4), a second joint portion (21) joined to a connection target (14) for the electronic component, an upr...

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Bibliographic Details
Main Authors NAKADA HITOSHI, HYUGA YUICHIRO, KANAI NAOYUKI
Format Patent
LanguageEnglish
Japanese
Published 29.09.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a wiring structure that can improve productivity.SOLUTION: A conductive member (5) constituting a wiring structure includes a first joint portion (20) joined to an electronic component (4), a second joint portion (21) joined to a connection target (14) for the electronic component, an upright portion (22) that protrudes upward from the first joint portion and is connected to the second joint portion, and an open-shaped wire rod passing portion (30) that is provided at least in a part of the upright portion and allows a wire rod (6) arranged from the first joint portion along the upright portion to be connected to the first joint portion so as to intersect with the surface (23, 25) along the upright portion.SELECTED DRAWING: Figure 1 【課題】生産性の向上を実現できる配線構造を提供する。【解決手段】配線構造を構成する導電部材（５）は、電子部品（４）に接合される第１接合部（２０）と、電子部品に対する接続対象（１４）に接合される第２接合部（２１）と、第１接合部から上方に突出して第２接合部へ連結する起立部（２２）と、少なくとも起立部の一部に設けられ、第１接合部から起立部に沿って配設される線材（６）を起立部に沿う面（２３、２５）と交差するように、第１接合部と接続可能にさせる開放形状の線材通過部（３０）と、を有する。【選択図】図１
Bibliography:Application Number: JP20220043577