STRUCTURE, SUBSTRATE, HEAT DISSIPATION SUBSTRATE, BONDED BODY AND POWER MODULE

• Main Author: FUKUDA YUMI
• Format: Patent
• Language: English; Japanese
• Published: 29.09.2023
• Subjects: ARTIFICIAL STONE; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CEMENTS; CERAMICS; CHEMISTRY; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS; CONCRETE; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; LIME, MAGNESIA; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PERFORMING OPERATIONS; PRINTED CIRCUITS; REFRACTORIES; SLAG; TRANSPORTING; TREATMENT OF NATURAL STONE

To provide a structure, a substrate, a heat dissipation substrate, a joined body, and a power module that have both high thermal conductivity and high strength.SOLUTION: According to an embodiment, a structure of the present invention has a grain and a grain boundary, the grain contains a β-type silicon nitride phase, the unit cell volume of the grain is between 145.45 Å3 and 145.60 Å3, and the average grin size of the grain is between 3.5 μm and 10 μm.SELECTED DRAWING: Figure 1 【課題】高熱伝導率と高強度を両立した構造体、基板、放熱基板、接合体及びパワーモジュールを提供する。【解決手段】実施形態によれば、結晶粒と、粒界とを有し、結晶粒はβ型窒化珪素相を含み、結晶粒の単位格子体積が１４５．４５Å３以上１４５．６０Å３以下であり、かつ、結晶粒の平均粒径が３．５μｍ以上１０μｍ以下である構造体である。【選択図】 図１