PREDICTION METHOD AND INFORMATION PROCESSING EQUIPMENT

• Main Authors: SUZUKI TAKAYUKI, SAITO YUSUKE, YAEGASHI KEITA, TAKAYOSHI JOJI, SAINO TAKAHARU, TAKEDA RYOHEI, TODO SOYA
• Format: Patent
• Language: English; Japanese
• Published: 29.09.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS; SEMICONDUCTOR DEVICES

To predict the processing results of plasma etching process.SOLUTION: A prediction method has a calculation process and a prediction process. The calculation process calculates a correlation between a spatial distribution value of a magnetic field in a chamber when a plasma etching process is performed on a substrate placed in the chamber and a processing result of the plasma etching process on the substrate. The prediction process predicts, based on the calculated correlation, a processing result of the plasma etching process for the substrate from the spatial distribution value of the magnetic field in the chamber.SELECTED DRAWING: Figure 5 【課題】プラズマエッチング処理の処理結果を予測すること。【解決手段】予測方法は、算出工程と、予測工程とを有する。算出工程は、チャンバ内に配置された基板にプラズマエッチング処理を実施した際のチャンバ内の磁場の空間分布値と、基板に対するプラズマエッチング処理の処理結果との相関関係を算出する。予測工程は、算出した相関関係に基づいて、チャンバ内の磁場の空間分布値から、基板に対するプラズマエッチング処理の処理結果を予測する。【選択図】図５