DEPOSITION METHOD AND PROCESSING DEVICE

• Main Authors: NOGAMI TAKAFUMI, NAKANO YOSHINORI
• Format: Patent
• Language: English; Japanese
• Published: 22.09.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

To reduce the generation of particles.SOLUTION: A deposition method includes a step (a) of forming a pre-coat film in a processing container, a step (b) of placing a substrate on a mounting table in the processing container after the step (a), and a step (c) of forming a target film on the substrate, and the pre-coat film has a Young's modulus of 100 GPa or more and 180 GPa or less, and/or a hardness of 7 GPa or more and 21 GPa or less.SELECTED DRAWING: Figure 3 【課題】パーティクルの発生を低減すること。【解決手段】（ａ）処理容器内にプリコート膜を形成することと、（ｂ）前記（ａ）の後、前記処理容器内の載置台に基板を載置することと、（ｃ）前記基板の上に対象膜を形成することと、を有し、前記プリコート膜は、ヤング率が１００ＧＰａ以上１８０ＧＰａ以下、及び／又は、硬度が７ＧＰａ以上２１ＧＰａ以下である、成膜方法が提供される。【選択図】図３