CONDUCTIVE PARTICLE, ADHESIVE FILM FOR CIRCUIT CONNECTION AND METHOD FOR MANUFACTURING THE SAME, AND CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
To provide conductive particles for an adhesive film for circuit connection which can improve insulation properties between adjacent electrodes in a connection structure and capturing properties of the conductive particles.SOLUTION: Conductive particles P for an adhesive film for circuit connection...
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Main Authors | , , , , |
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Format | Patent |
Language | English Japanese |
Published |
22.09.2023
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Abstract | To provide conductive particles for an adhesive film for circuit connection which can improve insulation properties between adjacent electrodes in a connection structure and capturing properties of the conductive particles.SOLUTION: Conductive particles P for an adhesive film for circuit connection include a conductive mother particle 31, and child particles 32 coating the surface of the mother particle 31, wherein a ratio of an average particle diameter in methyl ethyl ketone to the average particle diameter in the water, of the child particles 32 is more than 1.15 and 1.30 or less.SELECTED DRAWING: Figure 1
【課題】 接続構造体における隣り合う電極間の絶縁性と導電粒子の捕捉性を向上させることができる、回路接続用接着フィルム用の導電粒子を提供すること。【解決手段】 回路接続用接着フィルム用の導電粒子Pであって、導電性の母粒子31と、該母粒子31の表面を被覆する子粒子32と、を備え、子粒子32の、水中での平均粒子径に対するメチルエチルケトン中での平均粒子径の比が、1.15超1.30以下である、導電粒子P。【選択図】図1 |
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AbstractList | To provide conductive particles for an adhesive film for circuit connection which can improve insulation properties between adjacent electrodes in a connection structure and capturing properties of the conductive particles.SOLUTION: Conductive particles P for an adhesive film for circuit connection include a conductive mother particle 31, and child particles 32 coating the surface of the mother particle 31, wherein a ratio of an average particle diameter in methyl ethyl ketone to the average particle diameter in the water, of the child particles 32 is more than 1.15 and 1.30 or less.SELECTED DRAWING: Figure 1
【課題】 接続構造体における隣り合う電極間の絶縁性と導電粒子の捕捉性を向上させることができる、回路接続用接着フィルム用の導電粒子を提供すること。【解決手段】 回路接続用接着フィルム用の導電粒子Pであって、導電性の母粒子31と、該母粒子31の表面を被覆する子粒子32と、を備え、子粒子32の、水中での平均粒子径に対するメチルエチルケトン中での平均粒子径の比が、1.15超1.30以下である、導電粒子P。【選択図】図1 |
Author | YAMAZAKI SHOHEI MATSUZAKI TOSHIAKI TOMISAKA KATSUHIKO MATSUZAWA MITSUHARU SEKI HIDEYUKI |
Author_xml | – fullname: MATSUZAWA MITSUHARU – fullname: MATSUZAKI TOSHIAKI – fullname: TOMISAKA KATSUHIKO – fullname: SEKI HIDEYUKI – fullname: YAMAZAKI SHOHEI |
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DocumentTitleAlternate | 導電粒子、回路接続用接着フィルム及びその製造方法、並びに、接続構造体及びその製造方法 |
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Snippet | To provide conductive particles for an adhesive film for circuit connection which can improve insulation properties between adjacent electrodes in a connection... |
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SubjectTerms | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS CURRENT COLLECTORS DYES ELECTRICITY INSULATORS LINE CONNECTORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES |
Title | CONDUCTIVE PARTICLE, ADHESIVE FILM FOR CIRCUIT CONNECTION AND METHOD FOR MANUFACTURING THE SAME, AND CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME |
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