CONDUCTIVE PARTICLE, ADHESIVE FILM FOR CIRCUIT CONNECTION AND METHOD FOR MANUFACTURING THE SAME, AND CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

• Main Authors: MATSUZAWA MITSUHARU, MATSUZAKI TOSHIAKI, TOMISAKA KATSUHIKO, SEKI HIDEYUKI, YAMAZAKI SHOHEI
• Format: Patent
• Language: English; Japanese
• Published: 22.09.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; CONDUCTORS; CURRENT COLLECTORS; DYES; ELECTRICITY; INSULATORS; LINE CONNECTORS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; USE OF MATERIALS AS ADHESIVES

To provide conductive particles for an adhesive film for circuit connection which can improve insulation properties between adjacent electrodes in a connection structure and capturing properties of the conductive particles.SOLUTION: Conductive particles P for an adhesive film for circuit connection include a conductive mother particle 31, and child particles 32 coating the surface of the mother particle 31, wherein a ratio of an average particle diameter in methyl ethyl ketone to the average particle diameter in the water, of the child particles 32 is more than 1.15 and 1.30 or less.SELECTED DRAWING: Figure 1 【課題】 接続構造体における隣り合う電極間の絶縁性と導電粒子の捕捉性を向上させることができる、回路接続用接着フィルム用の導電粒子を提供すること。【解決手段】 回路接続用接着フィルム用の導電粒子Ｐであって、導電性の母粒子３１と、該母粒子３１の表面を被覆する子粒子３２と、を備え、子粒子３２の、水中での平均粒子径に対するメチルエチルケトン中での平均粒子径の比が、１．１５超１．３０以下である、導電粒子Ｐ。【選択図】図１