HEAT PROCESSING DEVICE

To provide a heat processing device that can prevent the temperature of a light emitting element from rising and efficiently heat a substrate.SOLUTION: A heat processing device 1 heats a semiconductor wafer W by irradiating the semiconductor wafer W with light. The heat processing device 1 includes...

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Bibliographic Details
Main Author YAMADA TAKAYASU
Format Patent
LanguageEnglish
Japanese
Published 22.09.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a heat processing device that can prevent the temperature of a light emitting element from rising and efficiently heat a substrate.SOLUTION: A heat processing device 1 heats a semiconductor wafer W by irradiating the semiconductor wafer W with light. The heat processing device 1 includes a chamber 6 that accommodates the semiconductor wafer W, a plurality of LED lamps 45 that emit light, and a plurality of optical fibers 46 that are respectively connected to the plurality of LED lamps 45. Furthermore, in the heat processing device 1, one end of each of the plurality of optical fibers 46 is connected to the LED lamp 45, and the other end of the plurality of optical fibers 46 is arranged in a plane to form a light emitting surface 47.SELECTED DRAWING: Figure 1 【課題】発光素子の温度上昇を防止し、基板を効率良く加熱することができる熱処理装置を提供する。【解決手段】熱処理装置１は、半導体ウェハーＷに光を照射することによって半導体ウェハーＷを加熱する。熱処理装置１は、半導体ウェハーＷを収容するチャンバー６と、光を発光する複数のＬＥＤランプ４５と、複数のＬＥＤランプ４５のそれぞれに個別に接続された複数の光ファイバー４６と、を備える。また、熱処理装置１において、複数の光ファイバー４６のそれぞれの一方端はＬＥＤランプ４５に接続されるとともに、複数の光ファイバー４６の他方端は面状に配されて発光面４７を形成する。【選択図】図１
Bibliography:Application Number: JP20220035881