COMPONENT MOUNTING EQUIPMENT AND COMPONENT MOUNTING METHOD

To provide component mounting equipment and a component mounting method that can easily achieve stable mounting of components that share common characteristics.SOLUTION: The component data with multiple operation parameters tied to the component parameters is tied to a label representing the charact...

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Bibliographic Details
Main Authors YOKOI TAKAAKI, MIZOGAMI DAISUKE
Format Patent
LanguageEnglish
Japanese
Published 20.09.2023
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:To provide component mounting equipment and a component mounting method that can easily achieve stable mounting of components that share common characteristics.SOLUTION: The component data with multiple operation parameters tied to the component parameters is tied to a label representing the characteristics of the component. Corresponding to the label of the component data, predetermined parameter information is set to the predetermined operation parameters of that component data (ST3), and the component is mounted on the substrate based on the operation parameters tied to the component data and the operation parameters with the parameter information set (ST4).SELECTED DRAWING: Figure 6 【課題】特徴が共通する部品の安定実装を容易に実現することができる部品実装装置および部品実装方法を提供する。【解決手段】部品パラメータに複数の動作パラメータを紐付けした部品データには、部品の特徴を表すラベルが紐付けされている。部品データのラベルに対応して、その部品データの所定の動作パラメータに所定のパラメータ情報を設定し（ＳＴ３）、部品データに紐付けされていた動作パラメータとパラメータ情報が設定された動作パラメータに基づいて、部品を基板に実装する（ＳＴ４）。【選択図】図６
Bibliography:Application Number: JP20220034016