TRANSFER MECHANISM

• Main Authors: NAKANISHI YUJI, CHISHIMA KAZUSHI
• Format: Patent
• Language: English; Japanese
• Published: 07.09.2023
• Subjects: BASIC ELECTRIC ELEMENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINE TOOLS; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

To provide a transfer mechanism for preventing drying of each chip and reducing deflection of a tape during transfer of a plurality of chips.SOLUTION: A transfer mechanism for transferring a frame unit 19 in which a workpiece 11 having a plurality of chips 13a divided therein is attached to a tape 1...