TRANSFER MECHANISM

• Main Authors: NAKANISHI YUJI, CHISHIMA KAZUSHI
• Format: Patent
• Language: English; Japanese
• Published: 07.09.2023
• Subjects: BASIC ELECTRIC ELEMENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINE TOOLS; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

To provide a transfer mechanism for preventing drying of each chip and reducing deflection of a tape during transfer of a plurality of chips.SOLUTION: A transfer mechanism for transferring a frame unit 19 in which a workpiece 11 having a plurality of chips 13a divided therein is attached to a tape 15 attached to a ring frame so as to close an opening at a center portion of a ring frame 17 in an area corresponding to the opening, and the ring frame, the tape and the plurality of chips are integrated with one another, includes a holding mechanism for holding the frame unit, and a moving mechanism for moving the holding mechanism. The holding mechanism includes a ring frame holding mechanism 26 having a plurality of holding members 22c each holding the ring frame, and a humidifying gas supply mechanism 42 which has a plate-shaped head portion 28 having one or more openings at the bottom portion thereof, and supplies a humidified gas from the one or more openings to the plurality of chips during transfer of the frame unit, thereby restraining drying of the plurality of chips.SELECTED DRAWING: Figure 6 【課題】複数のチップの搬送中に、各チップの乾燥を防ぐと共に、テープの撓みを低減する搬送機構を提供する。【解決手段】リングフレーム１７の中央部の開口を塞ぐ様にリングフレームに貼り付けられたテープ１５に対して複数のチップ１３ａに分割された被加工物１１が開口に対応する領域において貼り付けられ、リングフレーム、テープ及び複数のチップが一体化されたフレームユニット１９を搬送する搬送機構であって、搬送機構は、フレームユニットを保持する保持機構と、保持機構を移動させる移動機構と、を備える。保持機構は、リングフレームを夫々保持する複数の保持部材２２ｃを有するリングフレーム保持機構２６と、底部に１以上の開口を有する板状のヘッド部２８を有し、フレームユニットの搬送時に加湿された気体を１以上の開口から複数のチップに向かって供給することで複数のチップの乾燥を抑制する加湿気体供給機構４２と、を含む。【選択図】図６