FLATTENING AGENT FOR ORGANIC FILM FORMATION, COMPOSITION FOR ORGANIC FILM FORMATION, ORGANIC FILM FORMATION METHOD, AND PATTERN FORMATION METHOD

• Main Authors: ISHIWATA KENTA, OGIWARA TSUTOMU, YANO TOSHIHARU, YAMAMOTO YASUYUKI
• Format: Patent
• Language: English; Japanese
• Published: 06.09.2023
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a flattening agent for organic film formation from which a composition for organic film formation having high flattening characteristics is given, a composition for organic film formation containing the flattening agent, an organic film formation method using the composition, and a pattern formation method.SOLUTION: A flattening agent for organic film formation is composed of an aromatic-containing compound having a molecular weight represented by the molecular formula of 200-500, wherein the flattering agent for organic film formation is blended with a composition containing a resin for organic film formation and a solvent having complex viscosity of 1.0 Pa s or more in a temperature range of 175°C or higher, and thereby the complex viscosity of the composition becomes less than 1.0 Pa s in the temperature range of 175°C or higher.SELECTED DRAWING: Figure 2 【課題】高度な平坦化特性を持つ有機膜形成用組成物を与える有機膜形成用平坦化剤、この平坦化剤を含有する有機膜形成用組成物、この組成物を用いた有機膜形成方法、及びパターン形成方法を提供する。【解決手段】分子式で表される分子量が２００～５００である芳香族含有化合物からなる有機膜形成用平坦化剤であって、前記有機膜形成用平坦化剤を、複素粘性率が１７５℃以上の温度範囲において１．０Ｐａ・ｓ以上である、有機膜形成用樹脂及び溶剤を含む組成物に配合することにより、前記組成物の複素粘性率が１７５℃以上の温度範囲において１．０Ｐａ・ｓ未満になる温度範囲を有するものであることを特徴とする有機膜形成用平坦化剤。【選択図】図２