NICKEL-BASED ALLOY OR COBALT-BASED ALLOY PLATING FILM AND PLATING SOLUTION

• Main Author: MATSUI HIRONORI
• Format: Patent
• Language: English; Japanese
• Published: 30.08.2023
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

To provide a nickel-based alloy or cobalt-based alloy plating film that has a wide range of film thickness and hardness without a crack, and a plating solution.SOLUTION: A nickel-based alloy or cobalt-based alloy plating film containing platinum has an internal stress of between -20 MPa and 105 MPa. A plating solution includes metal ions and a platinum salt. The metal ions include at least nickel ions or cobalt ions. In the plating solution, the concentration of the platinum included in the platinum salt is between 0.010 g/L and 0.060 g/L.SELECTED DRAWING: None 【課題】幅広い膜厚及び硬度において、クラックが発生しない、ニッケル基合金又はコバルト基合金めっき膜及びめっき液を提供することを課題とする。【解決手段】 白金を含有し、内部応力が－２０ＭＰａ以上１０５ＭＰａ以下である、ニッケル基合金又はコバルト基合金めっき膜。金属イオンと白金塩を含むめっき液であって、前記金属イオンが少なくともニッケルイオン又はコバルトイオンを含み、前記めっき液中の前記白金塩に含まれる白金の濃度が０．０１０ｇ／Ｌ以上０．０６０ｇ／Ｌ以下である、めっき液。【選択図】なし