ELECTRONIC DEVICE

To provide a natural convection heat dissipation structure and a forced heat dissipation structure using fans as means of dissipating heat from a circuit board having a heat generating image sensor mounted thereon without increasing thickness of an image capturing device.SOLUTION: An image capturing...

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Bibliographic Details
Main Authors SATO HIDEKI, TOMIMOTO HONKAI
Format Patent
LanguageEnglish
Japanese
Published 30.08.2023
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Summary:To provide a natural convection heat dissipation structure and a forced heat dissipation structure using fans as means of dissipating heat from a circuit board having a heat generating image sensor mounted thereon without increasing thickness of an image capturing device.SOLUTION: An image capturing device of the present invention comprises heat dissipation fins 703a, b, c, f, g having curved shapes formed continuously from an inlet port 603 to first exhaust ports 604, 605 on a metal plate 703 when viewed from a direction perpendicular to the metal plate 703.SELECTED DRAWING: Figure 7 【課題】 撮像装置の厚みを増やすことなく、発熱する撮像素子が実装されている回路基板を放熱する方法として、自然対流の放熱構造、および、ファンなどを使った強制的な放熱構造を提供することを目的とする。【解決手段】 そこで、本発明の撮像装置は、金属板703と直交する方向から見た場合、金属板703上に形成された放熱フィン703a、b、c、f、gは、流入口603から第一の排出口604、605に向かって連続的に形成されている屈曲形状である。【選択図】 図7
Bibliography:Application Number: JP20220023563