BOARD PRESSING DEVICE AND BOARD PRESSING METHOD

• Main Authors: SAKAI TADAHIKO, MANTANI MASAYUKI, YOSHIOKA YUKI
• Format: Patent
• Language: English; Japanese
• Published: 29.08.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To make it possible to easily mount electronic components onto a solder precoat.SOLUTION: A disclosed board pressing device 400 includes: a backup section 405 that has a first main surface 1a and a second main surface 1b on the other side and has a support surface 405T that supports from below the second main surface 1b of a circuit board 1 having a solder precoat 3 formed on the first main surface 1a; a pair of side clampers 407 having a clamp surface 407S that contacts the side of the circuit board 1 to clamp the circuit board 1 supported by the backup section 405 between the clamp surfaces 407S; and a roller 432 that crushes the top of the solder precoat 3 by pressing the circuit board 1 clamped by the side clamper 407 from the first main surface 1a side. A rotation axis A of the roller 432 intersects with a direction in which the clamp surface 407S extends viewed from the normal direction of the first main surface 1a.SELECTED DRAWING: Figure 4 【課題】半田プリコートに電子部品を容易に搭載可能とする。【解決手段】開示される基板押圧装置４００は、第１主面１ａおよびその反対側の第２主面１ｂを有しかつ第１主面１ａに半田プリコート３が形成された基板１の第２主面１ｂを下方から支持する支持面４０５Ｔを有するバックアップ部４０５と、基板１の側面に当接するクランプ面４０７Ｓを有し、バックアップ部４０５に支持された基板１をクランプ面４０７Ｓで挟んでクランプする一対のサイドクランパ４０７と、サイドクランパ４０７によってクランプされた基板１を第１主面１ａ側から押圧することで半田プリコート３の頂部を押し潰すローラ４３２と、を備える。第１主面１ａの法線方向から見て、ローラ４３２の回転軸Ａは、クランプ面４０７Ｓが延びる方向と交差している。【選択図】図４