PROCESSING DEVICE

• Main Author: NAKATSUKA ATSUSHI
• Format: Patent
• Language: English; Japanese
• Published: 29.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINE TOOLS; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

To uniformly hold an in-plane thickness of a wafer after processing without grinding a holding surface when processing dust attached to the holding surface is removed.SOLUTION: A processing device 1 includes: a chuck table 10; a processing mechanism 20 for processing a wafer 100 held on the chuck ta...