PROCESSING DEVICE

• Main Author: NAKATSUKA ATSUSHI
• Format: Patent
• Language: English; Japanese
• Published: 29.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINE TOOLS; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

To uniformly hold an in-plane thickness of a wafer after processing without grinding a holding surface when processing dust attached to the holding surface is removed.SOLUTION: A processing device 1 includes: a chuck table 10; a processing mechanism 20 for processing a wafer 100 held on the chuck table 10; a table cleaning mechanism 30 for cleaning the holding surface 11; and a control part 50, wherein the table cleaning mechanism 30 includes: a base 311; a Peltier element 312 arranged on a lower surface of the base 311; a power supply part 34 for supplying DC power to the Peltier element 312; a lifting mechanism 33 for moving the base 311; and a water tank (water bonding mechanism) 35 for bonding water to the Peltier element 312, and the control part 50 bonds the water to a lower surface of the Peltier element 312, supplies the DC power to the Peltier element 312 and forms ice 39 on the lower surface of the Peltier element 312, lowers the base 311, brings the ice 39 into contact with the holding surface 11 and cleans the holding surface 11.SELECTED DRAWING: Figure 2 【課題】保持面に付着した加工屑を除去する際に保持面を削ることがなく、加工後のウェーハの面内厚さを均一に保持すること。【解決手段】チャックテーブル１０と、該チャックテーブル１０に保持されたウェーハ１００を加工する加工機構２０と、該保持面１１を洗浄するテーブル洗浄機構３０と、制御部５０と、を備える加工装置１であって、テーブル洗浄機構３０は、基台３１１と、該基台３１１の下面に配置するペルチェ素子３１２と、該ペルチェ素子３１２に直流電力を供給する電源部３４と、基台３１１を移動させる昇降機構３３と、ペルチェ素子３１２に水を付着させる水槽（着水機構）３５を備え、制御部５０は、ペルチェ素子３１２の下面に水を付着させ、ペルチェ素子３１２に直流電力を供給して該ペルチェ素子３１２の下面に氷３９を形成し、基台３１１を下降させ保持面１１に氷３９を接触させて該保持面１１を洗浄する。【選択図】図２