INK COMPOSITION CONTAINING N-SUBSTITUTED (METH)ACRYLAMIDE

To provide a polymerizable composition excellent in wettability to various substrates such as organic substrates, inorganic substrates, and substrates composed of an organic/inorganic composite material, having a wide polarity from a low polarity to high polarity, with high transparency and curabili...

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Bibliographic Details
Main Authors YILIXIATI MAIMAITIYIMING, YASUNAGA ATSUSHI, NARAZAKI YU
Format Patent
LanguageEnglish
Japanese
Published 18.08.2023
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Summary:To provide a polymerizable composition excellent in wettability to various substrates such as organic substrates, inorganic substrates, and substrates composed of an organic/inorganic composite material, having a wide polarity from a low polarity to high polarity, with high transparency and curability, and capable of providing a cured product having excellent water resistance through being cured, and also to provide a polymer of the polymerizable composition and various moldings using these.SOLUTION: A polymerizable composition contains a N-substituted (meth)acrylamide (A) expressed by a general formula [1] (in the formula, R1 denotes a hydrogen atom or a methyl group, one of R2 and R3 denotes a chain hydrocarbon group having 6 or more carbon atoms or a cyclic hydrocarbon group having 6 or more carbon atoms, and the other thereof denotes a hydrogen atom, a chain hydrocarbon group having 1 or more carbon atoms or a cyclic hydrocarbon group having 3 or more carbon atoms, and R2 and R3 include those with 6 or more membered saturation ring formed together with nitrogen atoms carrying thereof). 【課題】低極性から高極性までの幅広い極性を有する、有機系基材、無機系基材及び有機・無機複合材料からなる基材といった各種基材への濡れ性に優れ、高い透明性、硬化性を有し、硬化されることで優れる耐水性を有する硬化物を提供できる重合性組成物及び該重合性組成物の重合物、並びにそれらを用いた各種の成形品を提供することを課題とする。【解決手段】一般式[1]で表されるN-置換(メタ)アクリルアミド(A)を含有する重合性組成物。JPEG2023115013000017.jpg3077(式中、R1は水素原子又はメチル基を示し、R2とR3の一方は炭素数6以上の鎖式炭化水素基又は炭素数6以上の環式炭化水素基を示し、他方は、水素原子、炭素数1以上の鎖式炭化水素基又は炭素数3以上の環式炭化水素基を示し、R2及びR3は、それらを担持する窒素原子と一緒になって、6員以上の飽和環を形成したものを含む。)
Bibliography:Application Number: JP20230085965