COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING SYSTEM

• Main Authors: IKUTA TADASHI, KANEMICHI TOSHIKI, YOSHIDA IKUO, YAMAZAKI TAKUYA
• Format: Patent
• Language: English; Japanese
• Published: 18.08.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To provide a component mounting method capable of reducing the amount of combination processing to determine part placement.SOLUTION: A component mounting method in an aspect of the present invention includes: a component placement determination step (S10) that determines common component distribution when components are mounted on each of multiple types of substrates by distributing components to multiple mounting blocks, each of which is equipped with a head to which one or more of multiple types of nozzles that can pick up different types of components can be attached; and a mounting step (S20) of mounting the components placed in the relevant mounting block on the substrate according to the type of substrate for each of the multiple mounting blocks in which components are placed according to the determined component placement based on the determined component distribution. In the component placement determination step, component distribution is determined based on code information that indicates the correspondence of the types of the heads provided in each of the multiple mounting blocks with the types of components that can be mounted on the substrate by using the head.SELECTED DRAWING: Figure 3 【課題】部品配置を決定するための組み合わせ処理量を減らすことができる部品実装方法を提供する。【解決手段】本発明の一態様に係る部品実装方法は、互いに吸着可能な部品の種類が異なる複数種類のノズルのうちの１種類以上のノズルが装着されるヘッドがそれぞれ設けられた複数の実装ブロックへの部品の振り分けを行うことで、複数種類の基板のそれぞれに部品を実装する際の共通の部品振り分けを決定する部品配置決定ステップ（Ｓ１０）と、決定した部品振り分けに基づいて決定された部品配置で部品が配置された複数の実装ブロックのそれぞれで、基板の種類に応じて当該実装ブロックに配置された部品を基板に実装する実装ステップ（Ｓ２０）と、を含み、部品配置決定ステップでは、複数の実装ブロックのそれぞれに設けられるヘッドの種類と当該ヘッドを用いて基板に実装可能な部品の種類との対応関係を示すコード情報に基づいて部品振り分けを決定する。【選択図】図３