EPOXY RESIN COMPOSITION, FIBER-REINFORCED RESIN, AND PREPREG

• Main Authors: IKEDA HIROKI, SAKATA HIROAKI, TAKEDA ICHIRO
• Format: Patent
• Language: English; Japanese
• Published: 16.08.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

To provide a resin composition excellent in heat resistance, elastic modulus and strength, and a prepreg formed by impregnating a fiber substrate with the resin composition.SOLUTION: The present invention provides the resin composition having the following constitution. An epoxy resin composition contains components [A], [B] and [C]: [A] an aminophenol type epoxy resin or an aniline type epoxy resin having three or more epoxy groups on average per molecule; [B] an epoxy resin represented by the following formula (I) where R1 and R2 each represent a hydrocarbon group, X has at least one functional group selected from an amino group, an ester group, a sulfide group and a hydrazide group in addition to a hydroxyl group, n is an integer of 2 or 3, m is an integer of 1 or 2, and k is an integer of 1 or 2; and [C] a curing agent.SELECTED DRAWING: None 【課題】本発明では、耐熱性、弾性率、強度に優れた樹脂組成物、およびその樹脂組成物が繊維基材に含浸されて成るプリプレグを提供する。【解決手段】上記課題を解決するために、本発明は、次の構成を有する樹脂組成物を提供する。構成要素［Ａ］、［Ｂ］および［Ｃ］を含むエポキシ樹脂組成物。［Ａ］一分子あたり平均で３個以上のエポキシ基を有する、アミノフェノール型エポキシ樹脂またはアニリン型エポキシ樹脂［Ｂ］下式（Ｉ）で表されるエポキシ樹脂【化１】TIFF2023113285000016.tif21170ここで、式（Ｉ）において、Ｒ１およびＲ２は炭化水素であり、Ｘは、水酸基に加え、アミノ基、エステル基、スルフィド基またはヒドラジド基から選ばれる少なくともいずれか一つの官能基を有する。ｎは２または３で表される整数であり、ｍは１または２で表される整数であり、ｋは１または２で表される整数である。［Ｃ］硬化剤【選択図】なし