SUBSTRATE PROCESSING SYSTEM AND PARTICLE REMOVAL METHOD

To provide a technique for efficiently removing particles.SOLUTION: A particle removal operation has a process for conveying at least one end effector into any one of a vacuum transfer module, a substrate processing module, a load lock module, and an atmospheric transfer module, while at least one e...

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Bibliographic Details
Main Authors OBARA MASATO, NAGAIKE HIROSHI, SATO NAOKI, NAGATA HIDEYUKI
Format Patent
LanguageEnglish
Japanese
Published 10.08.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a technique for efficiently removing particles.SOLUTION: A particle removal operation has a process for conveying at least one end effector into any one of a vacuum transfer module, a substrate processing module, a load lock module, and an atmospheric transfer module, while at least one electrically charged charging member is placed on at least one end effector.SELECTED DRAWING: Figure 5 【課題】パーティクルを効率よく除去する技術を提供すること。【解決手段】パーティクル除去動作は、帯電した少なくとも１つの帯電部材を少なくとも１つのエンドエフェクタ上に載置した状態で、少なくとも１つのエンドエフェクタを真空搬送モジュール、基板処理モジュール、ロードロックモジュール、及び大気搬送モジュールのうちいずれかの内部を搬送する工程を有する。【選択図】図５
Bibliography:Application Number: JP20220013716