ELECTRONIC COMPONENT, ELECTRONIC CIRCUIT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
To provide an electronic component which can reduce a mounting area, an electronic circuit and a method for manufacturing the electronic component.SOLUTION: An electronic component 1 comprises a capacitor element 7, and an inductor element 2 electrically connected to the capacitor element. The capac...
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Main Authors | , |
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Format | Patent |
Language | English Japanese |
Published |
09.08.2023
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Subjects | |
Online Access | Get full text |
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Summary: | To provide an electronic component which can reduce a mounting area, an electronic circuit and a method for manufacturing the electronic component.SOLUTION: An electronic component 1 comprises a capacitor element 7, and an inductor element 2 electrically connected to the capacitor element. The capacitor element has: a first electrode part 71 extending between a first principal face 5a and a second principal face 5b in a direction crossing the first principal face, and located on a side of a substrate 5; a second electrode part 72 extending between the first and second principal faces in a direction crossing the first principal face, and opposed to the first electrode part in a direction parallel with the first principal face; and a first dielectric part 74 located between the first and second electrode parts. The inductor element has: an elemental body 10 having a third principal face 10a located on a side opposite to the substrate, and including a magnetic material; an inductor wire 21 provided in the elemental body, and extending in a direction parallel with the first principal face; and vertical wires 51-56 provided in the elemental body, connected to an end of the inductor wire and extending to the third principal face.SELECTED DRAWING: Figure 2
【課題】実装面積を小さくできる電子部品、電子回路及び電子部品の製造方法を提供する。【解決手段】キャパシタ素子7と、キャパシタ素子に電気的に接続されたインダクタ素子2と、を備える電子部品1であって、キャパシタ素子は、第1主面5aと第2主面5bの間で第1主面に交差する方向に延在し、基板5側に位置する第1電極部71と、第1主面と第2主面の間において第1主面に交差する方向に延在し、第1電極部に対して第1主面に平行な方向に対向する第2電極部72と、第1電極部と第2電極部の間に位置する第1誘電部74と、を有する。インダクタ素子は、基板と反対側に位置する第3主面10aを有し、磁性材料を含む素体10と、素体内に設けられ、第1主面に平行な方向に延在するインダクタ配線21と、素体内に設けられ、インダクタ配線の端部に接続され第3主面まで延在する垂直配線51~56と、を有する。【選択図】図2 |
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Bibliography: | Application Number: JP20220012142 |