HEATING LAMP AND HEATING DEVICE INCLUDING THE SAME
To provide a heating lamp and a heating device including the same capable of uniformly raising a wafer to a required temperature in a short time.SOLUTION: A lamp 100 for heating includes a metal heat dissipation substrate 102, an insulating layer 104 disposed on the heat dissipation substrate 102, a...
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Format | Patent |
Language | English Japanese |
Published |
31.07.2023
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Abstract | To provide a heating lamp and a heating device including the same capable of uniformly raising a wafer to a required temperature in a short time.SOLUTION: A lamp 100 for heating includes a metal heat dissipation substrate 102, an insulating layer 104 disposed on the heat dissipation substrate 102, a plurality of wiring patterns 106 arranged on the insulating layer 104, a plurality of light source elements 108 respectively arranged on the plurality of wiring patterns 106, a bonding material 109 electrically bonding the wiring pattern 106 and the light source element 108, and a metal wiring 110 electrically connecting adjacent light source elements 108.SELECTED DRAWING: Figure 1
【課題】ウエハを必要な温度まで短時間かつ均一に上昇させることのできる加熱用のランプ、およびそれを備える加熱装置を提供する。【解決手段】加熱用のランプ100を、金属製の放熱基板102と、放熱基板102上に配置された絶縁層104と、絶縁層104上に配置された複数の配線パターン106と、 複数の配線パターン106上にそれぞれ配置された複数の光源素子108と、配線パターン106と光源素子108とを電気的に接合する接合材109と、隣り合う光源素子108間を電気的に接続する金属配線110とで構成する。【選択図】図1 |
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AbstractList | To provide a heating lamp and a heating device including the same capable of uniformly raising a wafer to a required temperature in a short time.SOLUTION: A lamp 100 for heating includes a metal heat dissipation substrate 102, an insulating layer 104 disposed on the heat dissipation substrate 102, a plurality of wiring patterns 106 arranged on the insulating layer 104, a plurality of light source elements 108 respectively arranged on the plurality of wiring patterns 106, a bonding material 109 electrically bonding the wiring pattern 106 and the light source element 108, and a metal wiring 110 electrically connecting adjacent light source elements 108.SELECTED DRAWING: Figure 1
【課題】ウエハを必要な温度まで短時間かつ均一に上昇させることのできる加熱用のランプ、およびそれを備える加熱装置を提供する。【解決手段】加熱用のランプ100を、金属製の放熱基板102と、放熱基板102上に配置された絶縁層104と、絶縁層104上に配置された複数の配線パターン106と、 複数の配線パターン106上にそれぞれ配置された複数の光源素子108と、配線パターン106と光源素子108とを電気的に接合する接合材109と、隣り合う光源素子108間を電気的に接続する金属配線110とで構成する。【選択図】図1 |
Author | GODA TETSUYA KINOSHITA MASAAKI YAMASHITA KENICHI |
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DocumentTitleAlternate | 加熱用のランプ、およびそれを備える加熱装置 |
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Snippet | To provide a heating lamp and a heating device including the same capable of uniformly raising a wafer to a required temperature in a short time.SOLUTION: A... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | HEATING LAMP AND HEATING DEVICE INCLUDING THE SAME |
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