HEATING LAMP AND HEATING DEVICE INCLUDING THE SAME

To provide a heating lamp and a heating device including the same capable of uniformly raising a wafer to a required temperature in a short time.SOLUTION: A lamp 100 for heating includes a metal heat dissipation substrate 102, an insulating layer 104 disposed on the heat dissipation substrate 102, a...

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Bibliographic Details
Main Authors KINOSHITA MASAAKI, YAMASHITA KENICHI, GODA TETSUYA
Format Patent
LanguageEnglish
Japanese
Published 31.07.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a heating lamp and a heating device including the same capable of uniformly raising a wafer to a required temperature in a short time.SOLUTION: A lamp 100 for heating includes a metal heat dissipation substrate 102, an insulating layer 104 disposed on the heat dissipation substrate 102, a plurality of wiring patterns 106 arranged on the insulating layer 104, a plurality of light source elements 108 respectively arranged on the plurality of wiring patterns 106, a bonding material 109 electrically bonding the wiring pattern 106 and the light source element 108, and a metal wiring 110 electrically connecting adjacent light source elements 108.SELECTED DRAWING: Figure 1 【課題】ウエハを必要な温度まで短時間かつ均一に上昇させることのできる加熱用のランプ、およびそれを備える加熱装置を提供する。【解決手段】加熱用のランプ１００を、金属製の放熱基板１０２と、放熱基板１０２上に配置された絶縁層１０４と、絶縁層１０４上に配置された複数の配線パターン１０６と、 複数の配線パターン１０６上にそれぞれ配置された複数の光源素子１０８と、配線パターン１０６と光源素子１０８とを電気的に接合する接合材１０９と、隣り合う光源素子１０８間を電気的に接続する金属配線１１０とで構成する。【選択図】図１
Bibliography:Application Number: JP20220013291