UNDERFILL MATERIAL AND SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

• Main Authors: SHIRAKAMI MASASHI, SEKI KOHEI
• Format: Patent
• Language: English; Japanese
• Published: 28.07.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide an underfill material capable of suppressing cracking of a hard object in a case where a semiconductor package formed by sealing a semiconductor element with a large size (for example, an element including a semiconductor element with 20 mm square) is arranged to be used at 2000 cycles under an environment of -65°C to 150°C.SOLUTION: The underfill material contains epoxy resin, hardener, inorganic filler and rubber particles.SELECTED DRAWING: None 【課題】サイズの大きい半導体素子（例えば、２０ｍｍ角の半導体素子を含む）をアンダーフィル材で封止してなる半導体パッケージを、－６５℃～１５０℃の環境下で２０００サイクル配置した場合において、硬化物のクラックが抑制されるアンダーフィル材を提供すること。【解決手段】エポキシ樹脂と、硬化剤と、無機充填材と、ゴム粒子と、を含有するアンダーフィル材である。【選択図】なし