CONDUCTIVE FILM, WOUND BODY, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

• Main Authors: SHIMAMURA MITSUYOSHI, SHIRAKAWA TETSUYUKI, MATSUDA KAZUYA, KAWABATA YASUNORI, TATEZAWA TAKASHI, TSUCHIDA YUTAKA, SEKI TAKASHI, SHINOHARA KENGO, MATSUMOTO SATORU
• Format: Patent
• Language: English; Japanese
• Published: 20.07.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; CONDUCTORS; CURRENT COLLECTORS; DYES; ELECTRICITY; INSULATORS; LINE CONNECTORS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; USE OF MATERIALS AS ADHESIVES

To provide a conductive film, a wound body, a connection structure, and a method for manufacturing the connection structure capable of sticking an adhesive film to adhesive surfaces of various shapes and effectively using the adhesive film.SOLUTION: A conductive film 2 includes a long peeling film 4...