CONDUCTIVE FILM, WOUND BODY, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

To provide a conductive film, a wound body, a connection structure, and a method for manufacturing the connection structure capable of sticking an adhesive film to adhesive surfaces of various shapes and effectively using the adhesive film.SOLUTION: A conductive film 2 includes a long peeling film 4...

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Main Authors SHIMAMURA MITSUYOSHI, SHIRAKAWA TETSUYUKI, MATSUDA KAZUYA, KAWABATA YASUNORI, TATEZAWA TAKASHI, TSUCHIDA YUTAKA, SEKI TAKASHI, SHINOHARA KENGO, MATSUMOTO SATORU
Format Patent
LanguageEnglish
Japanese
Published 20.07.2023
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Summary:To provide a conductive film, a wound body, a connection structure, and a method for manufacturing the connection structure capable of sticking an adhesive film to adhesive surfaces of various shapes and effectively using the adhesive film.SOLUTION: A conductive film 2 includes a long peeling film 4 and a plurality of conductive adhesive film pieces 5 provided on the peeling film 4. The plurality of adhesive film pieces 5 are arranged in the longitudinal direction X of the peeling film 4 and spaced apart in the longitudinal direction X of the peeling film 4. The adhesive film pieces 5 contain conductive particles, and the adhesive film piece 5 has a hole 5a.SELECTED DRAWING: Figure 2 【課題】多様な形状の接着面に対して接着剤フィルムを貼り付けることができるともに、接着剤フィルムを有効に利用できる導電性フィルム、巻回体、接続構造体、及び接続構造体の製造方法を提供する。【解決手段】導電性フィルム2は、長尺の剥離フィルム4と、剥離フィルム4上に設けられた導電性を有する複数の接着剤フィルム片5と、を備える。そして、複数の接着剤フィルム片5は、剥離フィルム4の長手方向Xに配列されて剥離フィルム4の長手方向Xに離間しており、接着剤フィルム片5は、導電粒子を含み、接着剤フィルム片5は、穴5aを有する。【選択図】図2
Bibliography:Application Number: JP20230054094