RESIN COMPOSITION FOR ENCAPSULATION, ELECTRONIC COMPONENT DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE

• Main Authors: YAMAURA ITARU, TANAKA MIKA, BABA TORU, TAKEUCHI YUMA, KODAMA SHUNSUKE, SAITO TAKAHIRO
• Format: Patent
• Language: English; Japanese
• Published: 19.07.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a resin composition for encapsulation, a cured product of which has a low dielectric loss tangent, an electronic component device encapsulated thereby, and a method for manufacturing an electronic component device encapsulated thereby.SOLUTION: Provided is a resin composition for encapsulation, the composition containing an epoxy resin, a hardening agent and an inorganic filler material. The hardening agent contains an activate ester compound, and the average particle diameter of the inorganic filler material is 5 μm-100 μm.SELECTED DRAWING: None 【課題】硬化物の誘電正接が低い封止用樹脂組成物、これを用いて封止された電子部品装置、及びこれを用いて封止する電子部品装置の製造方法を提供する。【解決手段】エポキシ樹脂と硬化剤と無機充填材とを含有し、前記硬化剤が活性エステル化合物を含み、前記無機充填材の平均粒径が５μｍ～１００μｍである、封止用樹脂組成物。【選択図】なし