GAS SUPPLY UNIT AND SUBSTRATE PROCESSING APPARATUS INCLUDING SAME

• Main Authors: PARK EUNWOO, EUM KISANG, LEE WOORAM, PARK DONG WOON, LEE SUNG-GYU, CHO YONGDAE, KANG DONGHOON, KANG JONG WHA
• Format: Patent
• Language: English; Japanese
• Published: 07.07.2023
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; ATOMISING APPARATUS; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; NOZZLES; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SPRAYING APPARATUS; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

To provide a substrate processing apparatus.SOLUTION: A substrate processing apparatus includes: a processing unit processing a substrate; and a gas supply unit supplying gas to the processing unit, wherein the gas supply unit can includes: a first housing having a first internal space which is in fluid communication with a processing space of the processing unit; a second housing that is arranged in the first internal space, and includes a second internal space communicated with the first internal space in the fluid; and a gas supply duct that supplies the gas into the second internal space.SELECTED DRAWING: Figure 5 【課題】本発明は、基板を処理する装置を提供する。【解決手段】基板処理装置は、基板を処理する処理ユニットと、及び前記処理ユニットにガスを供給するガス供給ユニットを含み、前記ガス供給ユニットは:前記処理ユニットの処理空間と流体連通される第１内部空間を有する第１ハウジングと、前記第１内部空間に配置され、前記第１内部空間と流体連通される第２内部空間を有する第２ハウジングと、及び前記第２内部空間にガスを供給するガス供給ダクトを含むことができる。【選択図】図５