RETENTION DEVICE

• Main Author: KAWAMURA YUJI
• Format: Patent
• Language: English; Japanese
• Published: 07.07.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a retention device that improves temperature uniformity of a retention surface retaining an object.SOLUTION: A retention device comprises: a plate-like member 10 which comprises a retention surface and an undersurface; and a heater electrode 50 provide at the plate-like member 10 and arranged on an XY plane substantially orthogonal to a Z-axial direction. In an electrostatic chuck which retains a semiconductor wafer W on the retention surface of the plate-like member 10, the heater electrode 50 has: a first heater pattern 51 which is arranged in a first region 61 including a pad part 50 as one end part, and comprises circular arc parts 51a, 51b and 51c; a second heater pattern 52 which is arranged in a second region 62 including a pad part 50b as the other end part and different from the first region 61, and comprises circular arc parts 52a, 52b and 52c; and a third heater pattern 53 which is connected in parallel with the second heater pattern 52. The first heater pattern 51 and second heater pattern 52 are connected in series. The third heater pattern 53 is arranged in the first region 61.SELECTED DRAWING: Figure 3 【課題】対象物を保持する保持面における温度均一性を向上させる保持装置を提供する。【解決手段】保持装置は、保持面と、下面とを備える板状部材１０と、板状部材１０に設けられ、Ｚ軸方向と略直交するＸＹ面上に配置されるヒータ電極５０と、を備える。板状部材１０の保持面上に半導体ウエハＷを保持する静電チャックにおいて、ヒータ電極５０は、一方の端部であるパッド部５０ａを含む第１領域６１に配置され、円弧部５１ａ、５１ｂ、５１ｃを備える第１ヒータパターン５１と、他方の端部であるパッド部５０ｂを含む第１領域６１とは異なる第２領域６２に配置され、円弧部５２ａ，５２ｂ，５２ｃを備える第２ヒータパターン５２と、第２ヒータパターン５２に並列接続される第３ヒータパターン５３と、を有する。第１ヒータパターン５１と第２ヒータパターン５２とは、直列接続される。第３ヒータパターン５３は、第１領域６１に配置されている。【選択図】図３