CASE MATERIAL FOR ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING CASE MATERIAL FOR ELECTRONIC COMPONENT, CASE FOR ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING CASE FOR ELECTRONIC COMPONENT

To provide a new case material for an electronic component, capable of responding to diversified requirements, a case for an electronic component, and methods for manufacturing the same.SOLUTION: A case material for an electronic component includes a metal plate 10 and a resin layer 20 formed on at...

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Bibliographic Details
Main Authors KANAYAMA YUICHI, KANAYAMA TAIZO
Format Patent
LanguageEnglish
Japanese
Published 07.07.2023
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Summary:To provide a new case material for an electronic component, capable of responding to diversified requirements, a case for an electronic component, and methods for manufacturing the same.SOLUTION: A case material for an electronic component includes a metal plate 10 and a resin layer 20 formed on at least one surface of the metal plate 10 and comprising an ethylene-vinyl alcohol copolymer resin. A method for manufacturing a case material for an electronic component includes applying a coating agent containing an ethylene-vinyl alcohol copolymer resin, on a metal plate 10, and then forming a resin layer 20 from the coating agent. A case for an electronic component includes a substrate comprising a metal, and a resin layer formed on at least the outer surface of the substrate and comprising an ethylene-vinyl alcohol copolymer resin. A method for manufacturing a case for an electronic component includes a step of subjecting a case material 1 for an electronic component to deep drawing to form a case for an electronic component, the case including a substrate and a resin layer formed on at least the outer surface of the substrate.SELECTED DRAWING: Figure 1 【課題】多様化する要求事項に対応できる新たな電子部品用ケース材料、電子部品用ケース及びこれらの製造方法を提供する。【解決手段】金属板10と、金属板10の少なくとも一方の表面に形成されたエチレン-ビニルアルコール共重合体樹脂からなる樹脂層20とを有する電子部品用ケース材料。金属板10にエチレン-ビニルアルコール共重合体樹脂を含有するコーティング剤を塗布し、その後コーティング剤から樹脂層20を形成する電子部品用ケース材料の製造方法。金属からなる基体と、基体の少なくとも外側表面に形成されたエチレン-ビニルアルコール共重合体樹脂からなる樹脂層とを有する電子部品用ケース。電子部品用ケース材料1を深絞り加工し、基体と、基体の少なくとも外側表面に形成された樹脂層とを有する電子部品用ケースを形成する工程を含む電子部品用ケースの製造方法。【選択図】図1
Bibliography:Application Number: JP20210212154