LAMINATED FILM AND PACKAGE

To provide a laminated film capable of maintaining adhesion with an inorganic layer even under a heating condition such as retort treatment, and exhibiting a high gas barrier property even under a high humidity condition.SOLUTION: There is provided a laminated film that has a structure in which an i...

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Bibliographic Details
Main Authors SATO TAKASHI, KANAI SHINICHIRO
Format Patent
LanguageEnglish
Japanese
Published 07.07.2023
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Summary:To provide a laminated film capable of maintaining adhesion with an inorganic layer even under a heating condition such as retort treatment, and exhibiting a high gas barrier property even under a high humidity condition.SOLUTION: There is provided a laminated film that has a structure in which an intermediate resin layer (A) and an inorganic layer (B) are sequentially laminated on at least one side of a base film. The base film contains a polyester resin containing furandi-carboxylic acid as a dicarboxylic acid component and ethylene glycol as a diol component.SELECTED DRAWING: None 【課題】レトルト処理などの加熱条件下でも無機層との密着性を維持することができ、しかも、高湿下であっても高いガスバリア性を発現する積層フィルムを提供する。【解決手段】基材フィルムの少なくとも表裏一側に、中間樹脂層(A)及び無機層(B)が順次積層してなる構成を備え、前記基材フィルムが、フランジカルボン酸をジカルボン酸成分として含み、エチレングリコールをジオール成分として含むポリエステル樹脂を含むフィルムである、積層フィルムである。【選択図】なし
Bibliography:Application Number: JP20210212115