SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

• Main Author: KASHIWAGI MAKOTO
• Format: Patent
• Language: English; Japanese
• Published: 06.07.2023
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

To provide a substrate processing method which can monitor whether or not a substrate is properly held by a roller.SOLUTION: A substrate processing method brings three or more rollers 11a, 11b fixed to three or more eccentric shafts 13a, 13b including a reference shaft 13a and a movable shaft 13b into contact with a circumferential edge of a substrate W having a notch Nw, circularly moves the three or more rollers 11a, 11b to rotate the substrate W around the shaft center thereof, circularly moves the substrate W, brings a treatment tool 201 into contact with the substrate W rotated and circularly moved to process the substrate W, calculates the rotational speed of the substrate W on the basis of a measurement value of a notch detection sensor 77 for detecting that the notch Nw has passed through the movable shaft 13b during processing of the substrate W, and issues a warning when the calculated rotational speed of the substrate W deviates from an allowable range set to the theoretical rotational speed of the substrate W.SELECTED DRAWING: Figure 2 【課題】基板がローラに適切に保持されているか否かを監視可能な基板処理方法を提供する。【解決手段】基板処理方法では、基準軸１３ａと、可動軸１３ｂとを含む３つ以上の偏心軸１３ａ，１３ｂに固定された３つ以上のローラ１１ａ，１１ｂを、ノッチＮｗを有する基板Ｗの周縁部に接触させ、３つ以上のローラ１１ａ，１１ｂを円運動させることで、基板Ｗをその軸心を中心に回転させ、かつ基板Ｗを円運動させ、処理具２０１を、回転および円運動する基板Ｗに接触させて該基板Ｗを処理する。さらに、基板Ｗの処理中に、ノッチＮｗが可動軸１３ｂを通過したことを検知するノッチ検出センサ７７の測定値に基づいて、基板Ｗの回転速度を算出し、算出された基板Ｗの回転速度が基板Ｗの理論上の回転速度に対して設定された許容範囲から逸脱した場合は、警報を発する。【選択図】図２