THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED PLATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

• Main Authors: MURATA YUTA, KAKIYA MINORU, HATAKEYAMA NENE, TAKEGUCHI AYAKA, SATO NAOYOSHI, FUKUI MASATO, AKEBI RYUJI, OTSUKA KOHEI, TANIGAWA TAKAO
• Format: Patent
• Language: English; Japanese
• Published: 05.07.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MAKING GRANULES OR PREFORMS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

To provide a thermosetting resin composition which can improve a dielectric loss tangent (Df), and a prepreg, a resin film, a laminated plate, a printed wiring board and a semiconductor package, which are obtained by using the thermosetting resin composition.SOLUTION: A thermosetting resin composition contains (A) a thermosetting resin and (B) an inorganic filler, wherein (B) the inorganic filler has D10/D50 of 0.70 or more, when a particle diameter corresponding to cumulative 10 vol.% is represented by D10 and a particle diameter corresponding to cumulative 50 vol.% is represented by D50, from the small particle diameter side in a particle cumulative particle size distribution.SELECTED DRAWING: None 【課題】誘電正接（Ｄｆ）を改善し得る熱硬化性樹脂組成物を提供すること、並びに、当該熱硬化性樹脂組成物を用いて得られる、プリプレグ、樹脂フィルム、積層板、プリント配線板、及び半導体パッケージを提供すること。【解決手段】（Ａ）熱硬化性樹脂及び（Ｂ）無機充填材を含有する熱硬化性樹脂組成物であって、前記（Ｂ）無機充填材は、粒子の累積粒度分布において粒子径が小さい方から累積１０体積％に相当する粒子径をＤ１０、累積５０体積％に相当する粒子径をＤ５０と表したとき、Ｄ１０／Ｄ５０が０．７０以上である、熱硬化性樹脂組成物。【選択図】なし