CONDUCTIVE PASTE FOR JOINING

• Main Author: MATSUURA YUMI
• Format: Patent
• Language: English; Japanese
• Published: 04.07.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

To provide a conductive paste which is sufficiently bonded to an electronic component in a manufacturing process, and a method for manufacturing an electronic device using the same.SOLUTION: A method for manufacturing an electronic device includes the steps of: preparing a substrate including a conductive layer; coating a conductive paste onto the conductive layer, in which the conductive paste contains 100 pts.wt. of metal powder, 5-20 pts.wt. of a solvent, 0.01-3 pts.wt. of an adhesive, arbitrarily selectively, a polymer, and a surface active agent, and the adhesive is selected from the group consisting of a natural resin, a natural resin derivative and a mixture thereof; mounting an electronic component on the coated conductive paste; and heating the conductive paste; and joining the conductive layer and the electronic component.SELECTED DRAWING: Figure 1 【課題】製造プロセス中に、電子部品と十分に接着する導電性ペーストおよびこれを用いた電子デバイスの製造方法を提供する。【解決手段】導電層を含む基板を準備する工程と、導電層の上に導電性ペーストを塗布する工程であって、導電性ペーストが、１００重量部の金属粉、５～２０重量部の溶媒、０．０１～３重量部の接着剤、任意選択的にポリマー、及び任意選択的に界面活性剤を含む、接合用の導電性ペーストであり、接着剤は、天然樹脂、天然樹脂誘導体、およびこれらの混合物からなる群から選択される、工程と、塗布された導電性ペーストの上に電子部品を搭載する工程と、導電性ペーストを加熱して、導電層と電子部品とを接合する工程とを含む、電子デバイスの製造方法である。【選択図】図１