SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, SEMICONDUCTOR MANUFACTURING METHOD, AND PROGRAM
To obtain a technology with which, when conveying a substrate by a rotating arm and placing the conveyed substrate on a placement table, it is possible to suppress a positional deviation of the substrate from the placement table.SOLUTION: A technology according to the present embodiment comprises: a...
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Main Author | |
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Format | Patent |
Language | English Japanese |
Published |
04.07.2023
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Subjects | |
Online Access | Get full text |
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Summary: | To obtain a technology with which, when conveying a substrate by a rotating arm and placing the conveyed substrate on a placement table, it is possible to suppress a positional deviation of the substrate from the placement table.SOLUTION: A technology according to the present embodiment comprises: a conveyance device having a shaft that rotates, with the vertical direction as its axial direction and an arm that extends in the horizontal direction from the shaft and supports a substrate, the conveyance device rotating the arm that supports the substrate so as to convey the substrate to above the placement table; a detection unit for detecting the substrate conveyed by being supported to the arm; a conveyance control unit which is constituted so as to be capable of detecting a conveyance deviation of the substrate from the arm on the basis of the detection result of the detection unit and controlling the conveyance device so as to correct the positional deviation of the substrate from the placement table; and a processing unit for processing the substrate placed on the placement table.SELECTED DRAWING: Figure 5
【課題】基板を回転するアームにより搬送し、搬送した基板を載置台に載せる場合に、載置台に対する基板の位置ずれを抑制することができる技術を得る。【解決手段】本開示の技術は、軸方向を鉛直方向として回転するシャフトと、前記シャフトから水平方向に延びると共に基板を支持するアームとを有し、前記基板を支持した前記アームを回転させることで前記基板を載置台の上方に搬送する搬送装置と、前記アームに支持されて搬送される前記基板を検知する検知部と、前記検知部の検知結果に基づいて前記アームに対する前記基板の搬送ずれを検出し、前記載置台に対する前記基板の位置ずれを修正するように、前記搬送装置を制御することが可能なよう構成される搬送制御部と、前記載置台に載せられた前記基板を処理する処理部と、を備える。【選択図】図5 |
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Bibliography: | Application Number: JP20210208693 |