VARNISH COMPOSITION, METHOD FOR PRODUCING VARNISH COMPOSITION, AND METHOD FOR PRODUCING POLYIMIDE RESIN

• Main Authors: SAIJO HIDEKI, TADOKORO KEISUKE
• Format: Patent
• Language: English; Japanese
• Published: 29.06.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a varnish composition capable of forming a polyimide resin that achieves both of less coloration and excellent mechanical properties, a method for producing the varnish composition, and a method for producing a polyimide resin using the varnish composition.SOLUTION: A varnish composition comprises a polyamic acid (A), an imidazole compound (B) and a solvent (S), the polyamic acid (A) having a weight average molecular weight of 20,000 or more, the imidazole compound (B) having a specific structure, and the solvent (S) containing a urea-based solvent (S1) of 0 mass% or more and 10 mass% or less.SELECTED DRAWING: None 【課題】着色の少なさと優れた機械的特性とを兼ね備えるポリイミド樹脂を形成できるワニス組成物と、当該ワニス組成物の製造方法と、当該ワニス組成物を用いるポリイミド樹脂の製造方法とを提供すること。【解決手段】ポリアミック酸（Ａ）と、溶媒（Ｓ）とを含むワニス組成物において、重量平均分子量が、２０，０００以上であるポリアミック酸（Ａ）と、特定の構造のイミダゾール化合物（Ｂ）と、尿素系溶媒（Ｓ１）の含有量が０質量％以上１０質量％以下である溶媒（Ｓ）とを用いる。【選択図】なし