POLYAMIDE RESIN AND MOLDING CONTAINING THE SAME

To provide a polyamide resin which is excellent in moldability, and mechanical characteristics (tensile elastic modulus and tensile elongation, specifically, tensile elongation at break) even when being molded into a molding.SOLUTION: A polyamide resin has a terminal carboxyl group concentration of...

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Main Authors HANAOKA YASUNARI, DOYAMA DAISUKE, KURACHI KOICHIRO, KURAHASHI YOSUKE
Format Patent
LanguageEnglish
Japanese
Published 28.06.2023
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Summary:To provide a polyamide resin which is excellent in moldability, and mechanical characteristics (tensile elastic modulus and tensile elongation, specifically, tensile elongation at break) even when being molded into a molding.SOLUTION: A polyamide resin has a terminal carboxyl group concentration of 100 μeq/g or more, and [ηrel/ηrc] of more than 0.91 and less than 1.0. ηrel: relative viscosity measured according to JIS K-6920 (96% sulfuric acid, polymer concentration of 10 mg/ml, and 25°C). ηrc: relative viscosity calculated by the following approximate expression (1) from a number average molecular weight Mn. Expression (1): ηrc=K×Mnα. In the expression, K and α are constants determined by measuring the number average molecular weight Mn and relative viscosity ηrel of at least three arbitrary polyamide resins of the same kind as the polyamide resin, and performing fitting so that the measurement values are regarded as Mn and ηrc of Expression (1). In the expression, Mn is the number average molecular weight of the polyamide resin, and is calculated from the terminal carboxyl group concentration (μeq/g).SELECTED DRAWING: None 【課題】成形性に優れ、成形体とした場合の機械的特性(引張弾性率及び引張伸び、具体的には引張破断点伸び)に優れるポリアミド樹脂を提供する。【解決手段】末端カルボキシル基濃度が100μeq/g以上であり、[ηrel/ηrc]が0.91超~1.0未満である、ポリアミド樹脂。ηrel:JIS K 6920(96%硫酸中、ポリマー濃度10mg/ml、25℃)に準じて測定される相対粘度。ηrc:数平均分子量Mnから以下の近似式(1)によって算出される相対粘度。ηrc = K × Mnα・・・式(1)(式中、K及びαは、前記ポリアミド樹脂と同種類の少なくとも3つの任意のポリアミド樹脂について、数平均分子量Mn及び相対粘度ηrelを測定し、該測定値がそれぞれ式(1)のMn及びηrcであるとしてフィッティングすることにより決定される定数である。式中、Mnは前記ポリアミド樹脂の数平均分子量であり、末端カルボキシル基濃度(μeq/g)から算出される。)【選択図】なし
Bibliography:Application Number: JP20210021796