TARGET FOR NEUTRON GENERATION DEVICE, AND METHOD OF MANUFACTURING THE SAME

To provide a target for neutron generation device that improves heat conductivity and joining properties between a target material irradiated with a photon beam to generate neutrons and its circumference, and a method of manufacturing the same.SOLUTION: A target for neutron generation device compris...

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Main Authors HONDA SHOGO, YOSHIHASHI SACHIKO, TSUCHIDA KAZUTERU, URITANI AKIRA, HONJO YUKI, YONEMOTO TOMOHIRO
Format Patent
LanguageEnglish
Japanese
Published 23.06.2023
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Summary:To provide a target for neutron generation device that improves heat conductivity and joining properties between a target material irradiated with a photon beam to generate neutrons and its circumference, and a method of manufacturing the same.SOLUTION: A target for neutron generation device comprises a target material 51 which is irradiated with a photon beam to generate neutrons, a substrate 50 which is provided with a recessed part 110 for holding the target material 51, and a metal foil 52 which seals the target material 51 held at the recessed part 110, wherein the target material 51 is a lithium alloy material obtained by alloying part or the whole of lithium, and the target material 51 and substrate 50 are alloyed and joined together. A method of manufacturing the target includes: arranging a precursor made of metallic lithium or lithium alloy at the recessed part 110; heating the substrate 50 and the precursor to melt the precursor and then solidifying the precursor to alloy the precursor and substrate 50 together; and joining the metal foil 52 onto the substrate 50 to which the precursor is joined.SELECTED DRAWING: Figure 2 【課題】陽子線が照射されて中性子を発生させるターゲット材と周囲との伝熱性および接合性が向上する中性子発生装置用のターゲット、および、その製造方法を提供する。【解決手段】中性子発生装置用のターゲットは、陽子線が照射されて中性子を発生させるターゲット材51と、ターゲット材51を保持する凹部110が設けられた基板50と、凹部110に保持されたターゲット材51を密封する金属箔52とを備え、ターゲット材51は、リチウムの一部または全部が合金化したリチウム合金材であり、ターゲット材51と基板50が、互いに合金化して接合されている。ターゲットの製造方法は、凹部110に金属リチウムまたはリチウム合金からなる前駆体を配置し、基板50および前駆体を加熱して前駆体を溶融させた後、前駆体を凝固させて、前駆体と基板50とを互いに合金化させて接合し、前駆体が接合された基板50上に金属箔52を接合するものである。【選択図】図2
Bibliography:Application Number: JP20220135400