SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME
To reduce the restriction on an electrode to be connected to a semiconductor element.SOLUTION: A semiconductor substrate 10 includes: a GaN substrate 11 with a hexagonal crystal in which a first main surface 11a is an m-plane, one direction in a plane direction of the first main surface 11a is a dir...
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Main Author | |
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Format | Patent |
Language | English Japanese |
Published |
22.06.2023
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Subjects | |
Online Access | Get full text |
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Summary: | To reduce the restriction on an electrode to be connected to a semiconductor element.SOLUTION: A semiconductor substrate 10 includes: a GaN substrate 11 with a hexagonal crystal in which a first main surface 11a is an m-plane, one direction in a plane direction of the first main surface 11a is a direction along a c-axis direction, and a second main surface 11b on the opposite side of the first main surface 11a forms the other surface 10b of the semiconductor substrate 10; a plurality of first column regions 12 disposed on the first main surface 11a of the GaN substrate and formed of a first nitride semiconductor layer; and second column regions 13 disposed on the first main surface 11a of the GaN substrate 11, formed of a second nitride semiconductor layer with a higher band gap than the first nitride semiconductor layer, and forming a PSJ structure 14 with the first column regions. The first column regions and the second column regions are alternately disposed along the c-axis direction on the first main surface. Current flows between one surface 10a and the other surface 10b of the semiconductor substrate 10.SELECTED DRAWING: Figure 1
【課題】半導体素子と接続される電極の制約を低減する。【解決手段】半導体基板10は、六方晶とされ、第1主面11aがm面とされると共に第1主面11aの面方向における一方向がc軸方向に沿った方向とされ、第1主面11aと反対側の第2主面11bが半導体基板10の他面10bを構成するGaN基板11と、GaN基板の第1主面11a上に配置され、第1窒化物半導体層で構成される複数の第1カラム領域12と、GaN基板11の第1主面11a上に配置され、第1窒化物半導体層よりもバンドギャップの高い第2窒化物半導体層で構成され、第1カラム領域と共にPSJ構造14を構成する第2カラム領域13と、を有し、第1カラム領域および第2カラム領域は、第1主面におけるc軸方向に沿って交互に配列されており、半導体基板10の一面10aと他面10bとの間を電流が流れるようにする。【選択図】図1 |
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Bibliography: | Application Number: JP20220096016 |